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Plating Equipment×上村工業 - List of Manufacturers, Suppliers, Companies and Products

Plating Equipment Product List

1~3 item / All 3 items

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Dedicated vertical transport plating device for printed circuit boards 'UF Carrier'

Stable functionality! Three types available: side-running, ceiling-running, and gantry types.

The "UF Career" is a fully automatic programmable plating device that has received extremely high evaluations and achievements in terms of functionality and reliability since its release. It is a system that can handle everything from small items to large items, as well as a mixture of various processing items, and it automatically processes them through programming methods, such as rack processing, barrel processing, and basket processing. The stable functionality and the rich system that accommodates various specifications can be safely used in the precise manufacturing process of printed circuit boards. Additionally, we also offer a fully automatic plating device with a continuous transport system known as the "Elevator Type." 【Features】 ■ A system that mixes various processing items ■ Automatic processing through programming methods ■ A rich system that accommodates stable functionality and various specifications ■ Safe for use in the precise manufacturing process of printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

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Small item dedicated plating device 'Flow-through Plater RP-2'

A series of processes such as the first plating, rinsing, and second plating can be performed in one module!

The "Flow-through Plating System RP-2" is a fully automated plating device specifically designed for small items. A series of processes such as the first plating, rinsing, and second plating can be performed within a single module, and if the processing volume increases, additional modules can be added to accommodate it. Based on this product, we also offer the "RP-2FA," which has been developed to enhance productivity and achieve labor-saving and unmanned operations through full automation. 【Features】 ■ Capable of high current density (high-speed) plating ■ Plating of fine powders (10-50μm) is possible by changing the filter ■ The amount of liquid carried in/out and the generation of gas/mist are drastically reduced compared to conventional devices ■ A series of processes such as the first plating, rinsing, and second plating can be performed within a single module ■ If the processing volume increases, additional modules can be added to accommodate it *For more details, please refer to the PDF document or feel free to contact us.

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Vertical Conveying Continuous Plating Device 'U-VCPS'

A vertical continuous plating device with a simple structure and easy maintenance.

The "U-VCPS" is a fully automatic vertical transport continuous plating device without an upper and lower mechanism, designed for PKG/HDI substrates. It features a simple mechanism with only an upper clamp, capable of handling thin substrates of less than 50μm. The device has a sealed structure, is environmentally friendly, and its simple design makes maintenance easy. We also offer the "U-VCP," a vertical transport continuous electroplating device with a simple structure that minimizes the occurrence of failures. 【Features】 ■ Designed for PKG/HDI substrates ■ Simple mechanism with only an upper clamp ■ Capable of handling thin substrates of less than 50μm ■ Simple structure for easy maintenance ■ Efficient material transfer achieved through a unique circulation method *For more details, please refer to the PDF document or feel free to contact us.

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